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MEMS and Nanotechnology, Volume 5 [electronic resource] :Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics / edited by Gordon Shaw III, Barton C. Prorok, LaVern Starman, Cosme Furlong.

by Shaw III, Gordon [editor.]; Prorok, Barton C [editor.]; Starman, LaVern [editor.]; Furlong, Cosme [editor.]; SpringerLink (Online service).
Material type: materialTypeLabelBookSeries: Conference Proceedings of the Society for Experimental Mechanics Series: Publisher: Cham : Springer International Publishing : 2014.Description: VIII, 134 p. 124 illus. online resource.ISBN: 9783319007809.Subject(s): Engineering | Mechanics, applied | Nanotechnology | Engineering | Nanotechnology and Microengineering | Theoretical and Applied Mechanics | NanotechnologyDDC classification: 620.5 Online resources: Click here to access online
Contents:
From the Contents: Warpage Measurement of Simulated Electronic Packaging Assembly -- Nanomechanical Characterization of Lead Free Solder Joints -- In-Situ Surface Mount Process Characterization Using Digital Image Correlation -- Acoustic Waveform Energy as an Interconnect Damage Indicator -- Shape Optimization of Cantilevered Piezoelectric Devices -- Unique Fabrication Method for Novel MEMS Micro-contact Structure -- A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms -- Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics.
In: Springer eBooksSummary: MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including:   Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices & Fabrication In-Situ Mechanical Testing Nanoindentation Experimental Analysis of Low-Dimensional Materials for Nanotechnology
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From the Contents: Warpage Measurement of Simulated Electronic Packaging Assembly -- Nanomechanical Characterization of Lead Free Solder Joints -- In-Situ Surface Mount Process Characterization Using Digital Image Correlation -- Acoustic Waveform Energy as an Interconnect Damage Indicator -- Shape Optimization of Cantilevered Piezoelectric Devices -- Unique Fabrication Method for Novel MEMS Micro-contact Structure -- A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms -- Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics.

MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including:   Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices & Fabrication In-Situ Mechanical Testing Nanoindentation Experimental Analysis of Low-Dimensional Materials for Nanotechnology

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