Koha online

Your cart is empty.
Normal view MARC view ISBD view

Force Sensors for Microelectronic Packaging Applications [electronic resource] /by Jürg Schwizer, Michael Mayer, Oliver Brand.

by Schwizer, Jürg [author.]; Mayer, Michael [author.]; Brand, Oliver [author.]; SpringerLink (Online service).
Material type: materialTypeLabelBookSeries: Microtechnology and MEMS: Publisher: Berlin, Heidelberg : Springer Berlin Heidelberg, 2005.Description: VIII, 178 p. 149 illus. online resource.ISBN: 9783540269458.Subject(s): Chemistry | System safety | Electronics | Optical materials | Nanotechnology | Chemistry | Nanotechnology | Optical and Electronic Materials | Physics and Applied Physics in Engineering | Quality Control, Reliability, Safety and Risk | Electronics and Microelectronics, InstrumentationOnline resources: Click here to access online
Contents:
Sensor Design -- Measurement System -- Characterization -- Applications -- Conclusions and Outlook.
In: Springer eBooksSummary: This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.
Tags from this library: No tags from this library for this title. Add tag(s)
Log in to add tags.
    average rating: 0.0 (0 votes)
Item type Current location Call number Status Date due Barcode
MAIN LIBRARY
Available

Sensor Design -- Measurement System -- Characterization -- Applications -- Conclusions and Outlook.

This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

There are no comments for this item.

Log in to your account to post a comment.
@ Jomo Kenyatta University Of Agriculture and Technology Library

Powered by Koha