Lead-Free Soldering [electronic resource] /edited by Jasbir Bath.
by Bath, Jasbir [editor.]; SpringerLink (Online service).
Material type:
Item type | Current location | Call number | Status | Date due | Barcode |
---|---|---|---|---|---|
TK7874-7874.9 (Browse shelf) | Available | ||||
Long Loan | MAIN LIBRARY | TK7800-8360 (Browse shelf) | Available |
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R856-857 Deformable Models | QA641-670 Inequalities for Differential Forms | TK7800-8360 Lead-Free Soldering | TK7874-7874.9 Lead-Free Soldering | TA357-359 Microfluidic Technologies for Miniaturized Analysis Systems | Introduction to Boolean Algebras | TA1637-1638 Human Factors and Voice Interactive Systems |
Lead Restrictions and Other Regulatory Influences on the Electronics Industry -- Fundamental Properties of Pb-Free Solder Alloys -- Lead-Free Surface Mount Assembly -- Lead-Free Wave Soldering -- Lead-Free Rework -- Lead-Free Solder Joint Reliability -- Backward and Forward Compatibility -- PCB Laminates -- Lead-Free Board Surface Finishes -- Lead-Free Soldering Standards.
The push toward lead-free soldering in computers, cell phones and other electronic and electrical devices has taken on a greater urgency as laws have been passed or are pending in the United States, the European Union and Asia which ban lead-bearing solder. These new restrictions on hazardous substances are changing the way electronic devices are assembled, and specifically affect process engineering, manufacturing and quality assurance. Lead-Free Soldering offers in a single volume a broad collection of practical techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources. The book includes the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia. Written by recognized experts in both academia and industry, Lead-Free Soldering is a must-have guide for practicing engineers interested in the latest developments surrounding areas such as lead-free alloy properties, reflow, wave, rework , solder joint reliability, PCB laminates and surface finishes, and backward and forward compatibility.
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