Three-Dimensional Nanoarchitectures [electronic resource] :Designing Next-Generation Devices / edited by Weilie Zhou, Zhong Lin Wang.
by Zhou, Weilie [editor.]; Wang, Zhong Lin [editor.]; SpringerLink (Online service).
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BookPublisher: New York, NY : Springer New York : 2011.Description: XVIII, 538p. 359 illus., 238 illus. in color. online resource.ISBN: 9781441998224.Subject(s): Nanochemistry | Engineering | Computer engineering | Nanotechnology | Materials Science | Nanotechnology | Nanotechnology and Microengineering | Condensed Matter Physics | Nanochemistry | Electrical EngineeringDDC classification: 620.115 Online resources: Click here to access online
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Springer eBooksSummary: Devices built from three-dimensional nanoarchitectures offer a number of advantages over those based on thin-film technology, such as larger surface area to enhance the sensitivity of sensors, to collect more sunlight to improve the efficiency of solar cells, and to supply higher density emitters for increased resolution in flat panel displays. Three-dimensional nanoscale assembly has already been used to generate many prototypes of devices and sensors, including piezoelectric nanogenerators based on ZnO nanowire arrays, photovoltaic devices based on silicon nanowire array p-n junctions, and highly sensitive gas sensors based on metal oxide nanowire arrays among others. Three-Dimensional Nanoarchitectures: Designing Next-Generation Devices describes state-of-the-art synthesis, integration, and design strategies used to create three-dimensional nanoarchitectures for functional nanodevice applications. With a focus on synthesis and fabrication methods for three-dimensional nanostructure assembly and construction, coverage includes resonators, nanophotonics, sensors, supercapacitors, solar cells, and more. This book is an essential reference for a broad audience of researchers in materials science, chemistry, physics, and electrical engineering who want the latest information on synthesis routes and assembly methods. Schematics of device integration and mechanisms as well as plots of measurement data are included.
| Item type | Current location | Call number | Status | Date due | Barcode |
|---|---|---|---|---|---|
| TA418.9.N35 (Browse shelf) | Available | ||||
| Long Loan | MAIN LIBRARY | T174.7 (Browse shelf) | Available |
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| TA418.9.N35 Nanotechnology Standards | TA418.9.N35 Molecular- and Nano-Tubes | TA418.9.N35 NanoBiosensing | TA418.9.N35 Three-Dimensional Nanoarchitectures | TA418.9.N35 Metal Clusters and Nanoalloys | TA418.9.N35 Nanoscale Applications for Information and Energy Systems | TA418.9.N35 Transport Properties of Molecular Junctions |
Devices built from three-dimensional nanoarchitectures offer a number of advantages over those based on thin-film technology, such as larger surface area to enhance the sensitivity of sensors, to collect more sunlight to improve the efficiency of solar cells, and to supply higher density emitters for increased resolution in flat panel displays. Three-dimensional nanoscale assembly has already been used to generate many prototypes of devices and sensors, including piezoelectric nanogenerators based on ZnO nanowire arrays, photovoltaic devices based on silicon nanowire array p-n junctions, and highly sensitive gas sensors based on metal oxide nanowire arrays among others. Three-Dimensional Nanoarchitectures: Designing Next-Generation Devices describes state-of-the-art synthesis, integration, and design strategies used to create three-dimensional nanoarchitectures for functional nanodevice applications. With a focus on synthesis and fabrication methods for three-dimensional nanostructure assembly and construction, coverage includes resonators, nanophotonics, sensors, supercapacitors, solar cells, and more. This book is an essential reference for a broad audience of researchers in materials science, chemistry, physics, and electrical engineering who want the latest information on synthesis routes and assembly methods. Schematics of device integration and mechanisms as well as plots of measurement data are included.
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