Lead Free Solder [electronic resource] :Mechanics and Reliability / by John Hock Lye Pang.
by Pang, John Hock Lye [author.]; SpringerLink (Online service).
Material type:
BookPublisher: New York, NY : Springer New York, 2012.Description: X, 175p. 162 illus. online resource.ISBN: 9781461404637.Subject(s): Engineering | Materials | Electronics | Systems engineering | Optical materials | Engineering | Electronics and Microelectronics, Instrumentation | Optical and Electronic Materials | Continuum Mechanics and Mechanics of Materials | Circuits and SystemsDDC classification: 621.381 Online resources: Click here to access online | Item type | Current location | Call number | Status | Date due | Barcode |
|---|---|---|---|---|---|
| TK7874-7874.9 (Browse shelf) | Available | ||||
| Long Loan | MAIN LIBRARY | TK7800-8360 (Browse shelf) | Available |
Browsing MAIN LIBRARY Shelves Close shelf browser
| QP351-495 Detection of Malingering during Head Injury Litigation | BF1-990 Handbook of Ethnic Conflict | RD1-811 Operative Dictations in General and Vascular Surgery | TK7800-8360 Lead Free Solder | HV6001-7220.5 Handbook of European Homicide Research | TA1-2040 Theory of Arched Structures | TJ1-1570 A Concise Introduction to Mechanics of Rigid Bodies |
Introduction -- Theory on Mechanics of Solder Materials.-Mechanical Properties and Constitutive Models -- Fatigue Life Prediction Models -- Finite Element Analysis and Design-For-Reliability -- Thermo-Mechanical Reliability Test and Analysis -- Dynamic Mechanical Reliability Test and Analysis -- Thermal Cycling Aging Effects on Board-Level Drop Test Result.
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical properties of the lead-free solder materials used in the industry Focuses on mechanics of materials theory inelastic, plastic, creep, fatigue and fracture assessments Presents materials testing and characterization for bulk solder, solder joint and soldered assembly Details how to use reliability test and analysis for thermal cycling, cyclic bending and drop impact Lead Free Solder: Mechanics and Reliability is an ideal book for engineers working with semiconductor packaging and in the electronic manufacturing industry.
There are no comments for this item.